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3D Geo-Information Sciences (1 Angebot) In recent years 3D geo-information has become an important research area due to the increased complexity of tasks in many geo-scientific applications, such as sustainable urban planning and develop... |
Springer Verlag 9783642099519 |
€ 149,99* pro Stück |
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Springer Verlag 9783030647469 |
€ 299,99* pro Stück |
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Springer Verlag 9783030647490 |
€ 299,99* pro Stück |
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Springer Verlag 9783031355929 |
€ 39,99* pro Stück |
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Springer Verlag 9783031527593 |
€ 179,99* pro Stück |
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Schwager & Steinlein 9783849929626 |
€ 6,53* pro Stück |
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3D Stacked Chips (1 Angebot) This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integra... |
Springer Verlag 9783319793054 |
€ 49,99* pro Stück |
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Springer Verlag 9783031341182 |
€ 99,99* pro Stück |
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Springer Verlag 9783030400484 |
€ 199,99* pro Stück |
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50 Years of Artificial Intelligence (1 Angebot) Historical and Philosphical Issues.- AI in the 21st Century - With Historical Reflections.- The Physical Symbol System Hypothesis: Status and Prospects.- Fifty Years of AI: From Symbols to Embodime... |
Springer Verlag 9783540772958 |
€ 49,99* pro Stück |
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3D Geoinformation Science (1 Angebot) Nowadays 3D Geoinformation is needed for many planning and analysis tasks. For example, 3D city and infrastructure models are paving the way for complex environmental and noise analyzes. 3D geologi... |
Springer Verlag 9783319384887 |
€ 99,99* pro Stück |
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Springer Verlag 9783031474668 |
€ 279,99* pro Stück |
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Springer Verlag 9783031437809 |
€ 219,99* pro Stück |
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3D Microelectronic Packaging (1 Angebot) This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic ... |
Springer Verlag 9783319830865 |
€ 179,99* pro Stück |
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Springer Verlag 9783031341212 |
€ 69,99* pro Stück |
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