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| Artikel-Nr.: 858A-9783319204802 Herst.-Nr.: 9783319204802 EAN/GTIN: 9783319204802 |
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| This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. Weitere Informationen: | | Author: | Ibrahim (Abe) M. Elfadel; Gerhard Fettweis | Verlag: | Springer International Publishing | Sprache: | eng |
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| Weitere Suchbegriffe: allgemeine technikbücher - englischsprachig, Elektrotechnik, 3D Heterogeneous Integration, 3D Integrated Circuits, 3D Optoelectronic Integration, 3D Process Development, TSV Modeling and Circuit Techniques, Thermal Management of 3D ICs, Three-dimensional Integrated Circuit Design |
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