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| Artikel-Nr.: 858A-9783319792552 Herst.-Nr.: 9783319792552 EAN/GTIN: 9783319792552 |
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![](/p.gif) | This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. Weitere Informationen: ![](/p.gif) | ![](/p.gif) | Author: | Kazuo Kondo; Morihiro Kada; Kenji Takahashi | Verlag: | Springer International Publishing | Sprache: | eng |
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![](/p.gif) | Weitere Suchbegriffe: 3DInterconnects; 3Dpackaging; DieStacking; ThroughSilicon-vias; WaferHandling; Electrodeposition, 3D Interconnects, 3D Packaging, Die Stacking, Electrodeposition, Semiconductors, Through Silicon-vias, Wafer Handling |
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